DOW
PAL
BUD - PCB 廠商大募集
We are recruiting PCB Manufacturers!
The project is currently recruiting Hong Kong PCB manufacturers to participate. It has invited professionals from the industry and academia to select products based on factors such as production technologies, value-added services, and product categories. Successful applicants can participate in the following promotional activities for free:

 Presenting and introducing products in the “Hong Kong Pavilion” integrated exhibition area at the International Printed Circuit & APEX South China Fair in 2018
 Participating in the networking event and industrial forum in the "Hong Kong Pavilion" at the International Printed Circuit & APEX South China Fair in 2018
 Publishing interview content in the industry B2B magazine

  


 Wink Engage Now!Smile
 
Click here! →   For the Application Form
 
Application Deadline: November 9, 2018
 
 


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DRPP