The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three years in different cities around the world. In the last 40 years, members of the World Electronics Circuit Council (WECC) have taken turns to host this conference.

HKPCA is honored to host ECWC15 in 2020. The conferenceis scheduled to begin in Hong Kong on 30 November 2020 and conclude at the International Electronics Circuit Exhibition (Shenzhen)in South China on 2 December 2020.

The ECWC teams hope to provide a valuable platform to encourage learnings amongst peers and provide the latest on global PCB demand, PCB manufacturing processes as well as technologies to enable them to better cope with the changing market dynamics for trends such as 5G, autonomous driving, smart world and much more. It also aims to promote the domestic PCB industry and economic activities in every country and every region.

We welcome local and international papers and invite you to participate in this international event that occurs only every 3 years…network and share experiences with peers in the PCB and electronics manufacturing industry. For the submission of an abstract for ECWC15, please use our submission form as the attached.


Paper Scope
T1 Design and Development Tools 
T2 Materials, Components and Traceability 
T3 Manufacturing 
   T3.1 Equipment 
   T3.2 Technology 
   T3.3 Process Development 
   T3.4 Automation 
T4 Quality, Test and Life Cycle Management 
T5 PCB Processes
   T5.1 Chemical Technology 
   T5.2 Mechanical Technology 
   T5.3 Optical Technology 
T6 Surface Mounting, Assembly and Interconnection 
T7 Packaging Technology 
   T7.1 System in Package 
   T7.2 Wafer-Level Packaging 
   T7.3 Panel-Level Packaging 
T8 Energy Harvesting/Green Energy
T9 Application Specific Areas 
   T9.1 Automotive Electronics and Electromobility 
   T9.2 Industrial and Power Electronics 
   T9.3 Aerospace and Defence 
   T9.4 Medical Electronics 
   T9.5 Consumer Electronics 
T10. Advanced and Emerging Technologies
T11. 5G Requirements on PCBs
T12. Smart Living Applications
T13. E-Textiles/Smart Textiles
T14. Printed Electronics/Printed Hybrid

M1 Global Market Trends and Outlook 
M2 Supply Chain Management 
M3 Environment, Health and Safety 
M4 Business Models and Strategy 
M5 Certification and Qualifications 
M6 Total Cost of Ownership and Overall Equipment Efficiency (OEE)
M7 Industry 4.0/Smart manufacturing
M8 Traceability/Blockchain 

Hong Kong Printed Circuit Association  

HKPCA Hong Kong office 
Ms. Manda Wong 
T: 852 21555099

HKPCA Shenzhen Office 
Ms. Amanda Li 

T: 86 755 86240033

Hong Kong Productivity Council (HKPC) 
Ms. Samantha Chan 
T: 852 27886134


ECWC15 Call For Paper