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ECWC15
30/11-1/12/2020@Hongkong
2/12/2020@Shenzhen
The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three years in different cities around the world. In the last 40 years, members of the World Electronics Circuit Council (WECC) have taken turns to host this conference.
HKPCA is honored to host ECWC15 in 2020. The conferenceis scheduled to begin in Hong Kong on 30 November 2020 and conclude at the International Electronics Circuit Exhibition (Shenzhen)in South China on 2 December 2020.
The ECWC teams hope to provide a valuable platform to encourage learnings amongst peers and provide the latest on global PCB demand, PCB manufacturing processes as well as technologies to enable them to better cope with the changing market dynamics for trends such as 5G, autonomous driving, smart world and much more. It also aims to promote the domestic PCB industry and economic activities in every country and every region.
We welcome local and international papers and invite you to participate in this international event that occurs only every 3 years…network and share experiences with peers in the PCB and electronics manufacturing industry.
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Paper Scope |
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Date / Place
30 November to 1 December 2020: Hong Kong Science Park, Shatin
2 December 2020: Shenzhen Convention & Exhibition Center, China
2-4 December 2020: in conjunction with “International Electronics Circuit Exhibition (Shenzhen)”
Presentation formats
● Oral presentation
These will be held within conference sessions addressing key elements of the same topic. Each presentation should last 20 minutes. An extra 5 minutes will be permitted for discussions and questions from the audience.
● Poster presentation
The posters will be exhibited during the poster session.
Submission Deadline
Abstract submission……………………………………………………………2019.12.01-2020.02.29
Abstract acceptance notification………………………………………………2020.4.30
Full Paper submission…………………………………………………………2020.06.30
Final acceptance notification…………………………………………………2020.08.31
Oral presentation (PPT) / Poster presentation material submission………2020.10.31
Abstract Submission
The abstract should be submitted to ecwc15@hkpca.org as WORD-file in English and should comprise of 500-800 words.
Selection Process
All submitted abstracts will be presented to the committee for selection. The acceptance of your abstract depends on the following criteria: technical aspect, market aspect, innovation,
applicability and relevance of the conference themes. Punctuality and completeness are also
criteria. The committee reserves the right to allocate abstracts to a different topic where
suitable.
Best Paper Award
The ECWC15 Program Committee will nominate the best abstracts out of all submissions. After the submission of the final papers the winners of the Best Paper Awards will be determined. The awards ceremony will take place on 2 December 2020.
Technical Committee Member
CHAIRMAN | ||
Hong Kong Printed Circuit Association (HKPCA) | Ms. Audrey Sim | Vice President & Executive Director - Operation & Administration |
CO-CHAIRS | ||
Hong Kong Productivity Council (HKPC) | Dr. Ming Ge | rincipal Consultant, Smart Manufacturing and Materials Division |
ZTE Corporation | Mr. Zhe Liu | Chief Engineer, Institute of Manufacturing Engineering |
LOCAL TEAM | ||
Gainbase Industrial Ltd. | Mr. Benny Yip/span> | General Manager |
Hong Kong Printed Circuit Association (HKPCA) | Dr. Kinny Yeung | Honorary Adviser |
Huawei Technologies Co., Ltd | Mr. Andrew Gao | PCB material and process expert |
Isola Asia Pacific (Hong Kong) Ltd. | Mr. Dick Leung | Senior Director, Sales – HK & Southern China |
Lenovo Information Technology (Shanghai) Co., Ltd | Mr. Peter Deng | Advisory Engineer |
MacDermid Performance Solutions Hong Kong Limited | Mr. Ringo Kwong | Business Director |
Olympic Country Co Ltd. | Mr. Daniel Chan | Vice President, Innovation and Business Development |
Robert Bosch Co., Ltd. | Mr. James Tam | Project Manager |
The Hong Kong Polytechnic University | Prof. Winco Yung | rofessor, PhD, CEng, FHKIE, MIEEE, SrMHKSQ, |
TTM Technologies Inc. | Mr. Clay Zha | Vice President of Technology Solutions, Mobility BU |
WECC TEAM | ||
China Printed Circuit Association (CPCA) | Mr. Kevin Yan | Vice President |
China Printed Circuit Association (CPCA) | Mr. Wang Cheng Yong | Vice General Manager |
China Printed Circuit Association (CPCA) | Ms. Tang Yan Ling | Consultant |
European Institute of Printed Circuits (EIPC) | Mr. Alun Morgan | President |
European Institute of Printed Circuits (EIPC) | s. Tarja Rapala | Technical Director |
Association Connecting Electronics Industries (IPC) | Mr. David Bergman | VP Standards & Technology |
Association Connecting Electronics Industries (IPC) | Mr. Chris Jorgensen | Director Technology Transfer |
Japan Electronics Packaging and Circuits Association (JPCA) | Prof. Hirofumi (Harry) Matsumoto | Fellow/Senior Advisor, Nippon Mektron, Ltd. |
Japan Electronics Packaging and Circuits Association (JPCA) | Mr. Julian Bashore | Representative Director, MacDermid Performance Solutions Japan K.K. |
Korea Printed Circuit Association (KPCA) | Mr. HyungKun Kim | Technical Advisor |
Korea Printed Circuit Association (KPCA) | Mr. Minsu(Tim) Lee | Manager |
Taiwan Printed Circuit Association (TPCA) | Mr. Michael Chang | Director, DuPont Taiwan Limited |
Taiwan Printed Circuit Association (TPCA) | Mr. Jeffrey Lee | Assistant Vice President, iST-INTEGRATED SERVICE TECHNOLOGY INC |