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ECWC15


ECWC15
30/11-1/12/2020@Hongkong
2/12/2020@Shenzhen

The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three years in different cities around the world. In the last 40 years, members of the World Electronics Circuit Council (WECC) have taken turns to host this conference.

HKPCA is honored to host ECWC15 in 2020. The conferenceis scheduled to begin in Hong Kong on 30 November 2020 and conclude at the International Electronics Circuit Exhibition (Shenzhen)in South China on 2 December 2020.

The ECWC teams hope to provide a valuable platform to encourage learnings amongst peers and provide the latest on global PCB demand, PCB manufacturing processes as well as technologies to enable them to better cope with the changing market dynamics for trends such as 5G, autonomous driving, smart world and much more. It also aims to promote the domestic PCB industry and economic activities in every country and every region.

We welcome local and international papers and invite you to participate in this international event that occurs only every 3 years…network and share experiences with peers in the PCB and electronics manufacturing industry. 

 

Enquiry HKPCA HKPC
  (852) 2155 5099
ecwc15@hkpca.org
(852) 2788 6134
samanthachan@hkpc.org

Paper Scope
Technology
T1 Design and Development Tools 
T2 Materials, Components and Traceability 
T3 Manufacturing 
   T3.1 Equipment 
   T3.2 Technology 
   T3.3 Process Development 
   T3.4 Automation 
T4 Quality, Test and Life Cycle Management 
T5 PCB Processes
   T5.1 Chemical Technology 
   T5.2 Mechanical Technology 
   T5.3 Optical Technology 
T6 Surface Mounting, Assembly and Interconnection 
T7 Packaging Technology 
   T7.1 System in Package 
   T7.2 Wafer-Level Packaging 
   T7.3 Panel-Level Packaging 
T8 Energy Harvesting/Green Energy
T9 Application Specific Areas 
   T9.1 Automotive Electronics and Electromobility 
   T9.2 Industrial and Power Electronics 
   T9.3 Aerospace and Defence 
   T9.4 Medical Electronics 
   T9.5 Consumer Electronics 
T10. Advanced and Emerging Technologies
T11. 5G Requirements on PCBs
T12. Smart Living Applications
T13. E-Textiles/Smart Textiles
T14. Printed Electronics/Printed Hybrid


Management
M1 Global Market Trends and Outlook 
M2 Supply Chain Management 
M3 Environment, Health and Safety 
M4 Business Models and Strategy 
M5 Certification and Qualifications 
M6 Total Cost of Ownership and Overall Equipment Efficiency (OEE)
M7 Industry 4.0/Smart manufacturing
M8 Traceability/Blockchain 
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Date / Place 
30 November to 1 December 2020: Hong Kong Science Park, Shatin
2 December 2020: Shenzhen Convention & Exhibition Center, China
2-4 December 2020: in conjunction with “International Electronics Circuit Exhibition (Shenzhen)”

Presentation formats

● Oral presentation
These will be held within conference sessions addressing key elements of the same topic. Each presentation should last 20 minutes. An extra 5 minutes will be permitted for discussions and questions from the audience.

● Poster presentation
The posters will be exhibited during the poster session.

Submission Deadline
Abstract submission……………………………………………………………2019.12.01-2020.02.29

Abstract acceptance notification………………………………………………2020.4.30
Full Paper submission…………………………………………………………2020.06.30
Final acceptance notification…………………………………………………2020.08.31
Oral presentation (PPT) / Poster presentation material submission………2020.10.31

Abstract Submission
The  abstract should be submitted to ecwc15@hkpca.org as WORD-file in English and should comprise of 500-800 words.

Selection Process
All submitted abstracts will be presented to the committee for selection. The acceptance of your abstract depends on the following criteria: 
technical aspect, market aspect, innovation,

applicability and relevance of the conference themes. Punctuality and completeness are also
criteria. The committee reserves the right to allocate abstracts to a different topic where
suitable.

 

Best Paper Award
The ECWC15 Program Committee will nominate the best abstracts out of all submissions. After the submission of the final papers the winners of the Best Paper Awards will be determined. The awards ceremony will take place on 2 December 2020.

 

Technical Committee Member

CHAIRMAN    
Hong Kong Printed Circuit Association (HKPCA) Ms. Audrey Sim Vice President & Executive Director - Operation & Administration
CO-CHAIRS    
Hong Kong Productivity Council (HKPC) Dr. Ming Ge rincipal Consultant, Smart Manufacturing and Materials Division
ZTE Corporation Mr. Zhe Liu Chief Engineer, Institute of Manufacturing Engineering
LOCAL TEAM    
Gainbase Industrial Ltd. Mr. Benny Yip/span> General Manager
Hong Kong Printed Circuit Association (HKPCA) Dr. Kinny Yeung Honorary Adviser
Huawei Technologies Co., Ltd Mr. Andrew Gao PCB material and process expert
Isola Asia Pacific (Hong Kong) Ltd. Mr. Dick Leung Senior Director, Sales – HK & Southern China
Lenovo Information Technology (Shanghai) Co., Ltd Mr. Peter Deng Advisory Engineer
MacDermid Performance Solutions Hong Kong Limited Mr. Ringo Kwong Business Director
Olympic Country Co Ltd. Mr. Daniel Chan Vice President, Innovation and Business Development
Robert Bosch Co., Ltd. Mr. James Tam Project Manager
The Hong Kong Polytechnic University Prof. Winco Yung rofessor, PhD, CEng, FHKIE, MIEEE, SrMHKSQ,
TTM Technologies Inc. Mr. Clay Zha Vice President of Technology Solutions, Mobility BU
WECC TEAM    
China Printed Circuit Association (CPCA) Mr. Kevin Yan Vice President
China Printed Circuit Association (CPCA) Mr. Wang Cheng Yong Vice General Manager
China Printed Circuit Association (CPCA) Ms. Tang Yan Ling Consultant
European Institute of Printed Circuits (EIPC) Mr. Alun Morgan President
European Institute of Printed Circuits (EIPC) s. Tarja Rapala Technical Director
Association Connecting Electronics Industries (IPC) Mr. David Bergman VP Standards & Technology
Association Connecting Electronics Industries (IPC) Mr. Chris Jorgensen Director Technology Transfer
Japan Electronics Packaging and Circuits Association (JPCA) Prof. Hirofumi (Harry) Matsumoto Fellow/Senior Advisor, Nippon Mektron, Ltd.
Japan Electronics Packaging and Circuits Association (JPCA) Mr. Julian Bashore Representative Director, MacDermid Performance Solutions Japan K.K.
Korea Printed Circuit Association (KPCA) Mr. HyungKun Kim Technical Advisor
Korea Printed Circuit Association (KPCA) Mr. Minsu(Tim) Lee Manager
Taiwan Printed Circuit Association (TPCA) Mr. Michael Chang Director, DuPont Taiwan Limited
Taiwan Printed Circuit Association (TPCA) Mr. Jeffrey Lee Assistant Vice President, iST-INTEGRATED SERVICE TECHNOLOGY INC

 



2019/12/23-
ECWC15 Call For Paper
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