ECWC15


 

ECWC15 - Event Report

 

The ECWC15 Conference was successfully held virtually during 30 Nov to 2 Dec 2020.  The Conference gathered more than 300 PCB experts from companies around the globe.

 

The event kicked off with a Welcome Speech by Mr. Canice Chung, Chairman of HKPCA on Day 1. In his opening remark, Mr. Chung added that in-line with the conference theme, “Bridging Technology, Sharing Innovation”, technologies for the printed circuit board industry continues to be driven by 5G high frequency and high speed signal applications, leading to many more opportunities to emerge for high technology PCBs in the coming years.

 

The Conference covered hottest topics in PCB industry, keynote presentations included PCB industry history, latest trend and technology sharing, by Dr. Hayao Nakahara from of N.T. Information Ltd; the VeCS technology by Mr Happy Holden from I-Connect007 & PCB007 Magazine; 5G trend, technology and material development by Dr Shiuk-Kao Chiang from Prismark and Mr Zhe Liu from ZTE Corporation. Among three days conference, there were nine eye-catching keynote speaker sessions, 49 oral presentations and 30 poster presentations , which covered the hottest topics in PCB industry, including PCB material selection, automotive and Intelligent PCB Technology, Industrial Internet and IoT, AI technology on next generation display and so on…Besides, Day 3 conference was held simultaneously in conjunction with “International Electronics Circuit Exhibition (Shenzhen) 2020,a panel discussion focused on the 5G development and its driver for PCB Industry was organized at the event!

 

It is the first time for the Hong Kong Printed Circuit Association (HKPCA) to host the ECWC. In addition to that, this is also the very first time that the ECWC15 has to go virtual as well as being broadcasted in both English and Chinese. We sincerely thank for the participation of ECWC15 – the 3 years “PCB Olympics Event”, looking forward to meet you again at ECWC16 in 2023!