“Hong Kong Pavilion” at
the 2018 International Printed Circuit & APEX South China Fair


In order to provide opportunity for Hong Kong Printed Circuit Board manufacturers to demonstrate their advantages, the Hong Kong Printed Circuit Association has successfully applied BUD funding (Corporate Support Program) from Trade and Industry Department, HKSAR, together with the Hong Kong Productivity Council to organize a project to showcase the advantages of Hong Kong PCB manufacturers. Based on the success of last year, in this year, we will continue to establish the Hong Kong Pavilion at the International Printed Circuit & APEX South China Fair held at the Shenzhen Convention and Exhibition Center in China from December 5th to 7th, 2018. The Pavilion will showcase the PCB products of Hong Kong manufacturers to the Mainland and global markets, highlighting the high value-added and superb technologies in the emerging product category, and thereby promoting the superior image of Hong Kong PCB manufacturers.

 
The project is currently recruiting Hong Kong PCB manufacturers to participate. It has invited professionals from the industry and academia to select products based on factors such as production technologies, value-added services, and product categories. Successful applicants can participate in the following promotional activities for free:

 

♦ Presenting and introducing products in the “Hong Kong Pavilion” integrated exhibition area at the International Printed Circuit & APEX South China Fair in 2018
♦ Participating in the networking event and industrial forum in the "Hong Kong Pavilion" at the International Printed Circuit & APEX South China Fair in 2018
♦ Publishing video showing the advantages of Hong Kong PCB manufacturers 

 

 

For enquiry, please contact:
HKPC - Intelligent Robitics & Automation Unit
Ms. Suki Fan T: (852) 2788 5877; E: sukifan@hkpc.org
Ms. Samantha Chan T: (852) 2788 6134; E: samanthachan@hkpc.org

HKPCA - Secretariat
Ms. Manda Wong T: (852) 21555099; E: mandawong@hkpca.org