November Seminar: Copper Electroplating for High Aspect Ratio (HAR) Boards

Date:

November 2, 2018 (Friday)

Time:

2:00-5:00 PM

Venue:

東莞市柏寧長安國際酒店三樓宴會1號廳
東莞市長安鎮德政中路222

Seminar Content:



● Market & Technology Trend of HAR Boards
● Comparison of DC & Pulse Plating|
● Mechanism of Pulse Plating
● Pulse Plating Performance for HAR boards
● Practical Cases 

Target Audience:

Plating engineers, supervisors and related persons of PCB industry  

Introduction to speaker










David Wu (吳偉剛) is a Principal Scientist of Electronics & Imaging at Rohm and Haas Electronic Materials Asia Ltd (A Member of Dow Chemical Company).  He received his master degree in Electrochemistry from Xiamen University in 2010 and then joined Dow Chemical to lead the development of new products and the installations. He has extensive experience in many of PCB metal plating area including electroless copper plating, acidic copper plating, pulse plating, tin plating, etc.

Rex Hui (許瑋宜) is a Scientist of Electronic & Imaging at Rohm and Haas Electronic Materials Asia Ltd (A Member of Dow Chemical Company).  He received his master degree in Chemical and Biomolecular Engineering from the HKUST in 2016. Then he joined the company to provide technical service and application development for new product installations. With his extensive knowledges in pulse plating, the copper electroplating chemistry for HAR boards has been installed at different customers in South China and North China region.

Language:

Mandarin

Fee:







HKPCA Members - HK$370, or RMB310 per head (tax included): The fee includes handouts and refreshments. Please settle the payment before the event, or the reserved seats will be cancelled. If more than one people of the same company signed up for the training, group discount will be offered (For corporate members only):
3 to 4 persons- HK$320 or RMB270 per head (tax included)
5 or more persons - HK$250 or RMB210 per head (tax included)
Non-members - HK$570 or RMB480 per head (tax included): 
*The fee includes handouts and refreshments.

**Free lunch provided for participants engaged in both EHS symposium and August seminar!

Deadline:

October 30, 2018 (Tuesday)

Enquiry:  
                 
HKPCA Secretariat
Lily Lu; Tel#: (86) 755 8624 0033; Email ID: lilylu@hkpca.org
Susan Yuan; Tel#: (86) 755 8624 1673; Email ID: susanyuan@hkpca.org

Attachment: November Seminar: Copper Electroplating for High Aspect Ratio (HAR) Boards

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*EHS symposium to be held on 11:00 to 12:00 at the same venue. Welcome to participate.
For enquiry for the symposium, please contact Patrick Yu at (86) 755 8624 1689 or email to: patrickyu@hkpca.org