Research on HDI manufacturing Technology and Reliability Requirements
HKPCA & CPCA Jointly Organized Seminar

Smart phones are the key users of HDI boards in recent years. 2017 saw the introduction of high technology and advanced HDI(mSAP). The penetration of mSAP continued through 2018 and will further help the development of PCB market in the next few years.


In order to help members seize the market opportunities, HKPCA and CPCA will jointly hold a seminar on "Research on HDI manufacturing Technology and Reliability Requirements" in Dongguan on Friday, August 23rd, 2019. 

Organizer: HKPCA、CPCA



Objective:Provide audience a wider understanding of HDI and its reliability tests

Target Audience: PCB manufacturers who manufacture HDI and are interested in manufacturing more advanced HDI boards


Seminar Content: 

1. HKPCA Member – RMB500 OR HKD580 each (incl. notes, lunch and supplement)
2. Non-Member – RMB800 OR HKD930 each (incl. notes, lunch and supplement)
3. No Accommodation Provided

HKPCA Shenzhen Secretariat Tel:(86) 755 8624 1673 Susan Yuan / (86) 755 8624 0020 Eva Quan


Topic 1: Research on HDI manufacturing Technology and Reliability Requirements


1.Market and application field for HDI
2. Technical requirements for HDI in mobile phone application
3. Fine line Manufacturing:
3.1 The requirements of distribution of Copper Plating for fine line manufacturing
3.2 Vacuum etching technology
3.3 Two-fluid technology
4. Introduction of material and laminating technology for HDI manufacturing
5. The reliability requirements for HDI
5.1 The reliability tests for HDI
5.2 Test method and frequency
5.3 Failure Analysis


Introduction to speaker 

Mr. Su Xinhong graduated from Wuhan University and University of Electronic Science and Technology China with a bachelor's degree in physical chemistry and a master's degree in software engineering respectively. In 1989, he joined PCB industry and worked as process manager and quality manager, and later he had engaged in the build-up preparation of HDI factory. Currently, Mr.Su is Vice President of R&D Institute of Zhuhai Founder PCB Development Co., Ltd. and is responsible for R&D and technical management for the company. 


Topic 2:The most effective way for Microvia Metallization Process


1. Introduction on various types of Direct Metallization
2. Choice of DM in microvia fabrication
3. Via-Fill Process Introduction
4. A Study of microvia reliability
5. System Approach for total solution for microvia metallization


Introduction to speakers

Mr. Chen Chuwen graduated from South China University of Science and Technology with a double degree in Materials Science and English. From December 2010 to now, he worked in Macdermid Enthone company as the Manager of Metallized Product in China and Business Development manager in South China . He is responsible for metallization business development, direct metallization strategy and advanced product support. Previously to Macdrmid Enthone, he served in Atotech (Guangzhou)as an application manager of PTH products in South China and he was a trainer of Atotech. During this period, he was in charge of regional product support, mainly for PTH product application, including typical ion and colloidal palladium system and direct metallization products.

Mr. Thomas Chan graduated from the Hong Kong Baptist University and the City University of Hong Kong, who received a bachelor and master's degree in Applied Chemistry and Materials Science and Technology and Management respectively. 17 years of experience in PCB industry, Mr. Chan’s major is in PTH/DMSE & Electroplating, and he is familiar with practice & requirement of PCB industry. From 2013 to date, he works as the product manager of the electro-plating of PCB in Macdermid Enthone of Asia region, he is responsible for Market and the Technical Support in Asia-Pacific Region.


From 1995 to 1998, he worked in Atotech as a Technical Centre Supervisor of PCB lab & pilot line management and later as a Product Specialist (Senior) of PCB electroplating  for product marketing & customer support.

Prior to that , he worked at the Hong Kong Productivity Council (HKPC) as a project engineer from 2001-2013.


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